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terugvloeiingsoven

De machine van SMT AOI

Smt soldeerpasta-drukmachine

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Golf soldeermachine

SMT-de Machine van de laderlosinstallatie

smt transportband

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Huis > Producten >
de machines van de elektronikaproductie
>
Lead Free Mini Desktop Reflow Oven with Dual Heating System for SMT Soldering and PCB Assembly
Alle Categorieën

Oogst en Plaatsmachine

terugvloeiingsoven

De machine van SMT AOI

Smt soldeerpasta-drukmachine

SMT SPI-machine

SMT-machinelijn

Automatische invoegmachine

Golf soldeermachine

SMT-de Machine van de laderlosinstallatie

smt transportband

Kleefmachine

Conforme Deklaagmachine

Ovenmachine

PCB-Snijmachine

de machines van de elektronikaproductie

pcb-machine
Contacteer ons
Miss. Alina
alina@hxt-smt.com
+86 16620793861
wechat +86 16620793861
Contact nu
Lead Free Mini Desktop Reflow Oven with Dual Heating System for SMT Soldering and PCB Assembly
  • Naam
  • Naam
  • Naam
  • Naam
  • Naam
  • Naam
  • Naam

Lead Free Mini Desktop Reflow Oven with Dual Heating System for SMT Soldering and PCB Assembly

Merknaam: HXT
Modelnummer: RF-A500
MOQ: 1
Prijs: 7500
Verpakking: Vacuümverpakking plus houten doosverpakking
Betalingsvoorwaarden: T/T
Detailinformatie
Productomschrijving
Detailinformatie
Plaats van herkomst:
China
Certificering:
CE
naam:
BGA-verwerkingsstation
leverancier:
HXT
Modelnummer:
DH-A2E
Functie:
Volledig automatisch
Gebruik:
SMT-productielijn
PCB-grootte L*W (mm):
370 mm-370 mm
Stroom:
220v/50hz
Garantie:
1 jaar
Afmetingen L*W*H(mm):
600 mm x 700 mm x 850 mm
Gewicht (kg):
70 kg
Pakket:
houten kist verpakking
Levering vermogen:
De productiecapaciteit is 100 eenheden per maand.
Markeren:

Lead Free Reflow Oven

,

Mini Desktop SMT Soldering Machine

,

Dual Heating System PCB Assembly Machine

Productomschrijving
Lead Free Reflow Oven Machine Mini Desktop For PCB SMT Soldering Assembling Production Line
The Mini Desktop Reflow Oven is a professional-grade, compact thermal processing solution designed for prototyping, low-volume SMT assembly, and R&D. It combines space-saving design with industrial performance, featuring an advanced Dual Heating System that merges Strong 3D Hot Air Circulation with Super Infrared Radiation Heating. This innovative technology ensures precise, even, and efficient heat distribution across the entire PCB, achieving perfect solder reflow profiles for a wide range of lead-free and leaded solders. It is the ideal tool for engineers, labs, makerspaces, and small-batch production.
Lead Free Mini Desktop Reflow Oven with Dual Heating System for SMT Soldering and PCB Assembly 0
Product Specifications
Model RF-A200 RF-A250 RF-A350 RF-A500
Power Supply AC220V+10% 50Hz (AV110V Custom-Made)
Max Power 700W 1600W 2400W 3600W
Heating Method Infrared Radiation Heating and Hot Air Circulation
Effective Welding Area 200x150mm 250x200mm 350x300mm 500x400mm
Drawer Size L250xW180xH20mm L300xW250xH30mm L400xW330xH30mm L550xW430xH30mm
Operating System Chinese and English Bilingual Language Operate System
Display Mode Graph Mode/Text Mode and Display Mode Optional
Temperature Range Room Temperature -300°C
Temperature Curve Zones Preheating Zone, Heating Zone, Holding Zone and Cooling Zone Totally Five Zones
Outline Size (LxWxH) 375x350x312mm 425x400x312mm 525x500x312mm 675x600x312mm
Weight 13.5kg 19kg 24.9KG 37.1kg
Key Features
Advanced Dual Heating System
  • Strong 3D Hot Air Circulation + Super Infrared Radiation Heating: This hybrid technology delivers rapid, uniform heating from all directions. The infrared radiation provides direct, efficient energy transfer to components and the board, while the forced 3D hot air eliminates cold spots, ensuring every part of the assembly reaches the target temperature simultaneously.
Superior Thermal Performance
  • Heat Circulates Evenly: Patented airflow design and strategically placed heating elements guarantee a consistent temperature gradient across the entire heating chamber, critical for complex or densely populated boards.
  • Full Utilization of Thermal Energy: The system minimizes heat loss, translating to faster heating rates, lower energy consumption, and reduced operating costs.
  • Balanced Heating: Prevents component damage (tombstoning, cracking) caused by uneven thermal expansion, ensuring higher first-pass yield.
Optimal Welding Quality
  • Precision Profile Control: Achieves perfect reflow curves (preheat, soak, reflow, cooling) for various solder pastes, resulting in shiny, reliable solder joints with minimal voids.
  • Consistent, Repeatable Results: Essential for process control and quality assurance in professional settings.
User-Centric Design & Control
  • Intuitive Touchscreen/Controller: Easily set, store, and monitor custom reflow profiles.
  • Compact Desktop Footprint: Saves valuable bench space without compromising on chamber size.
  • Robust Safety Features: Includes over-temperature protection, automatic cooling, and safety lock.
Applications
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.
Tags: 

LED-lichttestmachine  

Infrarood BGA-herwerkingsstation  

Pcb-behandelingsconveyor

Goede prijs online

Details Van De Producten

Huis > Producten >
de machines van de elektronikaproductie
>
Lead Free Mini Desktop Reflow Oven with Dual Heating System for SMT Soldering and PCB Assembly
Alle Categorieën

Oogst en Plaatsmachine

terugvloeiingsoven

De machine van SMT AOI

Smt soldeerpasta-drukmachine

SMT SPI-machine

SMT-machinelijn

Automatische invoegmachine

Golf soldeermachine

SMT-de Machine van de laderlosinstallatie

smt transportband

Kleefmachine

Conforme Deklaagmachine

Ovenmachine

PCB-Snijmachine

de machines van de elektronikaproductie

pcb-machine
Lead Free Mini Desktop Reflow Oven with Dual Heating System for SMT Soldering and PCB Assembly
  • Naam
  • Naam
  • Naam
  • Naam
  • Naam
  • Naam
  • Naam

Lead Free Mini Desktop Reflow Oven with Dual Heating System for SMT Soldering and PCB Assembly

Merknaam: HXT
Modelnummer: RF-A500
MOQ: 1
Prijs: 7500
Verpakking: Vacuümverpakking plus houten doosverpakking
Betalingsvoorwaarden: T/T
Detailinformatie
Productomschrijving
Detailinformatie
Plaats van herkomst:
China
Merknaam:
HXT
Certificering:
CE
Modelnummer:
RF-A500
naam:
BGA-verwerkingsstation
leverancier:
HXT
Modelnummer:
DH-A2E
Functie:
Volledig automatisch
Gebruik:
SMT-productielijn
PCB-grootte L*W (mm):
370 mm-370 mm
Stroom:
220v/50hz
Garantie:
1 jaar
Afmetingen L*W*H(mm):
600 mm x 700 mm x 850 mm
Gewicht (kg):
70 kg
Pakket:
houten kist verpakking
Min. bestelaantal:
1
Prijs:
7500
Verpakking Details:
Vacuümverpakking plus houten doosverpakking
Levertijd:
5-15
Betalingscondities:
T/T
Levering vermogen:
De productiecapaciteit is 100 eenheden per maand.
Markeren:

Lead Free Reflow Oven

,

Mini Desktop SMT Soldering Machine

,

Dual Heating System PCB Assembly Machine

Productomschrijving
Lead Free Reflow Oven Machine Mini Desktop For PCB SMT Soldering Assembling Production Line
The Mini Desktop Reflow Oven is a professional-grade, compact thermal processing solution designed for prototyping, low-volume SMT assembly, and R&D. It combines space-saving design with industrial performance, featuring an advanced Dual Heating System that merges Strong 3D Hot Air Circulation with Super Infrared Radiation Heating. This innovative technology ensures precise, even, and efficient heat distribution across the entire PCB, achieving perfect solder reflow profiles for a wide range of lead-free and leaded solders. It is the ideal tool for engineers, labs, makerspaces, and small-batch production.
Lead Free Mini Desktop Reflow Oven with Dual Heating System for SMT Soldering and PCB Assembly 0
Product Specifications
Model RF-A200 RF-A250 RF-A350 RF-A500
Power Supply AC220V+10% 50Hz (AV110V Custom-Made)
Max Power 700W 1600W 2400W 3600W
Heating Method Infrared Radiation Heating and Hot Air Circulation
Effective Welding Area 200x150mm 250x200mm 350x300mm 500x400mm
Drawer Size L250xW180xH20mm L300xW250xH30mm L400xW330xH30mm L550xW430xH30mm
Operating System Chinese and English Bilingual Language Operate System
Display Mode Graph Mode/Text Mode and Display Mode Optional
Temperature Range Room Temperature -300°C
Temperature Curve Zones Preheating Zone, Heating Zone, Holding Zone and Cooling Zone Totally Five Zones
Outline Size (LxWxH) 375x350x312mm 425x400x312mm 525x500x312mm 675x600x312mm
Weight 13.5kg 19kg 24.9KG 37.1kg
Key Features
Advanced Dual Heating System
  • Strong 3D Hot Air Circulation + Super Infrared Radiation Heating: This hybrid technology delivers rapid, uniform heating from all directions. The infrared radiation provides direct, efficient energy transfer to components and the board, while the forced 3D hot air eliminates cold spots, ensuring every part of the assembly reaches the target temperature simultaneously.
Superior Thermal Performance
  • Heat Circulates Evenly: Patented airflow design and strategically placed heating elements guarantee a consistent temperature gradient across the entire heating chamber, critical for complex or densely populated boards.
  • Full Utilization of Thermal Energy: The system minimizes heat loss, translating to faster heating rates, lower energy consumption, and reduced operating costs.
  • Balanced Heating: Prevents component damage (tombstoning, cracking) caused by uneven thermal expansion, ensuring higher first-pass yield.
Optimal Welding Quality
  • Precision Profile Control: Achieves perfect reflow curves (preheat, soak, reflow, cooling) for various solder pastes, resulting in shiny, reliable solder joints with minimal voids.
  • Consistent, Repeatable Results: Essential for process control and quality assurance in professional settings.
User-Centric Design & Control
  • Intuitive Touchscreen/Controller: Easily set, store, and monitor custom reflow profiles.
  • Compact Desktop Footprint: Saves valuable bench space without compromising on chamber size.
  • Robust Safety Features: Includes over-temperature protection, automatic cooling, and safety lock.
Applications
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.
Tags: 

LED-lichttestmachine

Infrarood BGA-herwerkingsstation

Pcb-behandelingsconveyor

+86 16620793861
Snelkoppeling
Huis Over ons producten Toepassing Nieuws Gevallen Contacteer ons
Snel contact

Adres

Gebouw nr. 142 / B311, Songyu Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen China.

Tel.

+86-16620793861

+86 16620793861
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